The market today requires electronic devices with advanced features and increasingly compact dimensions. The trend towards miniaturization places designers in front of difficult challenges, linked above all to the increasing integration density of the required components and the inevitable problems of overheating.
In this article we will see how the approach developed by Carbice Corporation, based on the use of carbon nanotubes, has made it possible to create an effective cooling system that combines the properties of both liquid and solid thermal interface materials (TIMs) in a single solution.
. . .